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Immersion Gold FR4 / Polyimide 6 Layer FPC Multilayer Printed Circuit Board For

Immersion Gold FR4 / Polyimide 6 Layer FPC Multilayer Printed Circuit Board For

Place of Origin : China
Brand Name : RON
Certification : TS16949
MOQ : 1PC
Packaging Details : vacuum-packed
Delivery Time : customer requirements
Payment Terms : T/T
Supply Ability : not limited
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Immersion Gold FR4 / Polyimide 6 Layer FPC Multilayer Printed Circuit Board For Automobile



Material: FR4/POLYIMIDE

Surface treatment: immersion Gold

Width/space: 4/4mil
Finish thickness: 0.6mm

Min Hot:0.3mm


application:



LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics,Medical devices, CCTV, Power supply, GPS, UPS, Set-top Box.

SPECIFICATION

Materials

Polyimide

Polyester ( PET)

Remark&

(Kapton)

Test Method

 

1~20(Rigid-Flex & Multilayers FPC)

1~2

 

Single Sided

0.050 mm

 

Double Sided

0.075 mm

 

Drilling P.T.H.

0.2 mm

 

Punching

1.0 mm

 

Conductor Width (W)

0.025 mm

W0.5mm

Hole Diameter (H)

0.05 mm (withP.T.H.0.1mm)

H1.5mm

Accumulated Pitch (P)

0.05 mm (Special0.03mm)

P25mm

Outline Dimension (L)

0.05 mm

L50 mm

Conductors and Outline (C)

0.15 mm (Special 0.07mm)

C5.0 mm

Conductors and Coverlay

0.3~0.5 mm

 

Surface Treatment on

Soft or Hard Ni/Au Sn/Pb (2~60μm)

Primary FluxCarbon Printed

4~10μm Silver Gel printed

 

Terminals and land Areas

Insulation Resistance

1000MW

IPC-TM-650 2.6.3.2

at Ambient

Dielectric Strength

5KV

IPC-TM-650 2.5.6.1

Surface Resistance (W)

5x012

2x015

IPC-TM-650 2.5.17

Volume Resistivity (W-cm)

1x015

1x015

IPC-TM-650 2.5.17

Dielectric Constant (1 MHz)

4

3.4

IPC-TM-650 2.5.5.3

Dissipation Factor (1 MHz)

0.04

0.02

IPC-TM-650 2.5.5.3

Peeling Strength (180 irection)

1.2kgf/cm

1.2kgf/cm

IPC-TM-650 2.4.9

Solder Heat Resistance

260 .C/10secs

210 .C/3secs

Flammability

94 V-0

94VTM-0

UL94

Water Absorption

2.90%

1.00%

ASTM D570%

(24 Hours)


OEM Custom Service

Board Thickness:0.5mm~3.0mm (0.02"~0.12")

Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ

Outline: Routing, punching, V-Cut

Solder mask: White/Black/Blue/Green/Red, Taiyo PSR4000 white

Legend/Silkscreen Color: Black/White

Surface finishing: Immersion Gold, HASL, OSP

Max Panel size: 600*1200mm (23.62"*47.24")

Packing: Vacuum/Plastic bag

Layer: 1 - 20 layers


Product Tags:

multilayer board

      

multilayer circuit

      

multilayer circuit boards

      
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